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Precision Dicing Saw for Wafer Cutting Ds613

Product Description

DS613 precision dicing machine uses DS-200 software control system, touch screen control and GUI interface so that the image alignment of workpiece is simple and convenient. DS613 has stable performance and low failure rate. DS613 is applicable to the cutting process of silicon, PCB, EMC, ceramic, glass, lithium niobate, quartz, sapphire, GaAs and crystal.

Features
  1. Self-check and alarm function of height measurement system
  2. Database management of workpiece and cutting blade
  3. Two-way blade lifting for cutting  
  4. Graphic alignment function
  5. Real-time display and early warning of blade edge exposure
Specifications
 
Configuration and performance      Workpiece sizeΦ6'' | 160mm x 160mm
Groove depth≤4mm or customize
Table flatness±0.005mm/100mm
Alignment system70x straight light + ring light(210x optional) 
SpindleRevolution speed range3000~40000 rpm 
Output power1.25kW
X axisDrive modeServo motor
Max. stroke240mm
Stroke resolution0.001mm
Feed speed range0.1~400mm/s
Y axis Drive modeStep motor + grating closed-loop control system
Max. stroke170mm
Stroke resolution0.0005mm
Single-step positioning accuracy≤0.003mm/5mm
Index positioning accuracy ≤0.005mm/170mm
Z axisDrive modeStep motor
Max. stroke30mm
Stroke resolution0.001mm 
Repeatability accuracy0.002mm
Θ axis Drive modeServo motor
Max. rotating angle360°
Angle resolution0.0005° 
Basic specificationPower supplySingle phase, AC220V±10%
Power consumption0.8kW (processing)
0.7kW (warming up)
Compressed airPressure: 0.55~0.8Mpa; average flow rate: 350L/min
Cleaning water Pressure: 0.2~0.4Mpa; flow rate: 3.0L/min
Cooling waterPressure: 0.2~0.4Mpa; flow rate: 1.5L/min
Exhaust air rate2m3/min (ANR)
Overall dimensions W×D×H665mm×850mm×1650 mm
Weight 500kg
 
Environmental Conditions
 
• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
Please follow the product manual of our company.

About Us:
Precision Dicing Saw for Wafer Cutting Ds613


Precision Dicing Saw for Wafer Cutting Ds613


Precision Dicing Saw for Wafer Cutting Ds613

Certifications:
Precision Dicing Saw for Wafer Cutting Ds613


FAQ:
1.    Q: Are you manufacturer or trading company?
        A: We are manufacturer which focuses on Pressure Sensor for 33 years.
2.    Q: What international certificates do you have?
        A: ISO9001, CE, RoHS Certificated.
3.    Q: What is your production capacity?
        A: We produced 1500000 pieces pressure sensor in year 2017.
4.    Q: What is the lead time of your product?
        A: Stocks are available for some products. The typical lead time is 8~14 working days for product without customization. 
       Note: lead time may vary base on different products. Please contact us for detailed lead time. 
5.    Q: What is the warranty of your products?
       A: Our warranty time is 18 months after shipment.
6.    Q: Do you provide customized products?
       A: Yes, we can laser mark your logo, model and product information according to your requirement. We provide OEM and ODM service.
 

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Product Categories : Precision Dicing Saw